- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 27/00 - Coupling parts adapted for co-operation with two or more dissimilar counterparts
Patent holdings for IPC class H01R 27/00
Total number of patents in this class: 612
10-year publication summary
|
78
|
52
|
78
|
54
|
65
|
49
|
50
|
37
|
29
|
14
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Apple Inc. | 50209 |
15 |
| Samsung Electronics Co., Ltd. | 131630 |
12 |
| Panduit Corp. | 1007 |
12 |
| Hon Hai Precision Industry Co., Ltd. | 4157 |
8 |
| Molex, LLC | 1792 |
8 |
| Travel Blue Limited | 35 |
8 |
| Vivo Mobile Communication Co., Ltd. | 9833 |
8 |
| Sanofi-Aventis Deutschland GmbH | 2738 |
7 |
| Huawei Technologies Co., Ltd. | 100781 |
7 |
| Hewlett-Packard Development Company, L.P. | 28538 |
6 |
| Molex Incorporated | 609 |
6 |
| Lennox Industries Inc. | 1088 |
6 |
| Kiwi Connection, LLC | 15 |
6 |
| Japan Aviation Electronics Industry, Limited | 1585 |
5 |
| WorldConnect AG | 28 |
5 |
| Fullink Technology Co., Ltd | 16 |
5 |
| Guangdong Gopod Group Co., Ltd. | 60 |
5 |
| Ford Global Technologies, LLC | 19702 |
4 |
| Yazaki Corporation | 6282 |
4 |
| Huawei Device Co., Ltd. | 2758 |
4 |
| Other owners | 471 |